BC410 is specifically designed for automatic cleaning of SMT solder paste printer squeegees.

The squeegee is fixed onto a rotating bracket inside the cleaning chamber. As the bracket rotates, the combined physical action of ultrasonic vibration and spray jetting, along with the chemical decomposition capability of a water-based solder paste cleaning solution, breaks down and removes solder paste residues from the squeegee surface, corners, and gaps.

After cleaning, the squeegee is rinsed with clean water and finally dried with hot air.

Machine Process:

Put in squeegees–chemical wash–DI water rinse–Hot air dry–Take out squeegees

Machine Features:

Stainless steelmachine, acid and alkali corrosion resistance.
Ultrasonic vibration + spray jetting combined cleaning method.
Rotating squeegee bracket for 360° comprehensive cleaning.
One-key easy
A visual window on cleaning chamber, allowing observation of the cleaning process.
Fixture-type clamping for easy loading and unloading of squeegees.
PLC +HDMI control system with adjustable parameters: solution temperature, cleaning time, rinse cycles/time, drying time, drying temperature, etc.
Dual pumps and dual independent systems for cleaning and rinsing — each with its own separate tank and separate piping.
Real-time circulating filtration for both rinse solution and rinse water.
Top cover with double-layer thermal insulation — low outer surface temperature.
Chemical and DI water auto add and drain system.
Mitsubishi, Schneider, Omron, Nanpump…famous electric devices.