BC420

BC420 Solder Paste Feeding Device Cleaning Machine The BC420 is specially designed for the automatic cleaning of the automatic solder paste feeding device of SMT solder paste printers. The solder paste feeding device is fixed on a rotary bracket inside the cleaning chamber with the bracket rotating during the cleaning process. It leverages the physical forces of ultrasonic vibration and spray jetting, as well as the chemical decomposition capability of water-based solder paste cleaning fluid, to decompose, remove and thoroughly clean the solder paste residues inside and outside the feeding device. After the cleaning process, the device is rinsed with clean water and finally dried with hot air.

Technical Features 1. The entire body is made of SUS304 stainless steel, resistant to acid and alkali corrosion with a 15-year service life. 2. Combined cleaning with two methods: ultrasonic vibration and spray jetting. 3. Rotary scraper rotating bracket enables 360° full-range cleaning. 4. One-button operation. 5. The cleaning chamber is equipped with a visual window for observing the cleaning process. 6. Fixture-type clamping method facilitates the loading and unloading of the solder paste feeding device. 7. Equipped with PLC control; parameters such as solution temperature, cleaning time, rinsing times/duration, drying time and drying temperature can be set. 8. Dual-pump and dual-system for cleaning and rinsing, with separate independent liquid tanks and independent pipelines respectively. 9. Real-time circulating filtration for rinsing fluid and rinsing water. 10. Double-layer heat insulation design for the upper cover keeps the outer layer at a low temperature.